Production possibilities

Maximum size of produced PCB [mm]	500 x 600 – double layer, 350 x 500 – multilayer
Base material	FR4, CEM1, IMS, High-Tg FR4, Teflon
Base material thickness [mm]	0.4, 0.6, 0.8, 1.0, 1.2, 1.55, 2.0 2.4, 3
Base copper thickness [µm]	18, 35, 70, 105
Minimum / Maximum vias [mm]	0,3 / 6,5
Minimum solder pad diameter [mm]	0,3/0,3 + hole diameter
Minimum wire thickness [um]	150
Minimum space thickness[um]	150
Surface treatment	HAL (lead-free), Chem. NiAu, Chemical tin
Solder mask	screen printing, wet photoway (colors green, red, white, blue)
Silk screen	screen printing, photoway (colors white, red, green)
Mechanical finish	Scoring, milling, cutting
Input data	Gerber 274-D, Gerber 274-X, Excellon, Sieb-Meyer, Eagle-BRD, CAM350, Altium Designer, DXF

Manufacturer	Material type	Name	Tg [°C]	T288	Td [°C]	CTE	CTI (V)	datasheet
Shanghai NANYA	FR4 standard	NY1140	140	2	310	65		odkaz
Taiwan NANYA (Technolam)	FR4 standard	FR-4-86 UV BLOCK	140	2-5	310	50-70	3 (175-249)	odkaz
AIS MALIBAR	CEM1	CEM1-714	300	20	–	–	–	odkaz
CHIN-SHI	IMS, MCPCB ALU base	CS-AL-88 AD2	–	6	410	–	>600	odkaz
ISOLA	FR4 s Tg180	FR4 IS410	180	10	350	55	3 (175-249)	odkaz
Taconic	FR4 for VF applications	TLX-8				215		odkaz
Taiwan NANYA	FR4 with Tg175	NP-175F R	175	> 15	350	45	3 (175-249)	odkaz
Isola	FR4 non-halogen – made in Germany	DE156	155	> 10	390	45	–	odkaz
Rogers	FR4 for highfrequency applications	R3000	–	–	500	25	–	odkaz
Rogers	FR4 for highfrequency applications	R4000	> 280	–	425	46	–	odkaz

On stock
To order

Construction classes that we make (units in µm)	I.	II.	III.	IV.	V.	VI.
Minimum wire thickness	500	400	350	300	200	150
Minimum isolation space (Clearance)	650	450	350	300	200	150
Smallest hole diameter	800	700	600	500	400	300
Minimum pad over hole overlap	950	700	400	300	200	150